Preface:
In 2025, anyone walking into a newly built data center would be shocked by the scene: no roar of fans, no dense forest of network cables.
Instead, servers quietly boiling submerged in fluoride liquid, and laser signals flashing between racks.

With the exponential growth of large model parameters, the compute bottleneck has shifted from "Calculation" to "Interconnect" and "Heat Dissipation." This article delves into the physical layer, dismantling the hardware foundation supporting the AI 2.0 era.